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OAI’s Panel Level Mask Aligner for FOPLP Model 6020S - Semi or Automated
Enabling FO-PLP Processing at 500mm x 500mm Wafer Sizes

OAI掩模對準器，不同的印刷方式

距離: 間隙可設置在***個非常寬的范圍內，增量精度1µM

軟接觸: •基材被帶入非常柔軟的機械接觸曝光時的掩模。通過接觸力可調軟件設置

金屬觸點: •接觸額外的氮氣壓力

真空接觸: •真空***別控制接觸力。真空度為由用戶設置


OAI Mask Aligners
Various Printing Modes

PROXIMITY: 
• THE GAP IS SETTABLE OVER A VERY WIDE RANGE WITH AN  INCREMENTAL PRECISION OF 1µM 

SOFT CONTACT: 
• SUBSTRATE IS BROUGHT INTO VERY SOFT MECHANICAL CONTACT WITH THE MASK DURING EXPOSURE. THE CONTACT FORCE IS ADJUSTABLE VIA  SOFTWARE SETTINGS

HARD CONTACT:
• CONTACT WITH ADDITIONAL N2 pressure VACUUM CONTACT: 
• VACUUM LEVEL CONTROLS THE CONTACT FORCE. LEVEL OF VACUUM IS SET BY USER

OAI’s Panel Level Mask Aligner for FOPLP Model 6020S - Semi or Automated
Enabling FO-PLP Processing at 500mm x 500mm Wafer Sizes