Physical Properties: |
*Color: Part A: Silver Part B: Silver | Weight Loss: |
*Consistency: Smooth, thixotropic paste | @ 200°C: 0.59% |
*Viscosity (@ 100 RPM/23°C): 2,200 – 3,200 cPs | @ 250°C: 1.09% |
Thixotropic Index: 4.63 | @ 300°C: 1.67% |
*Glass Transition Temp.(Tg): ≥ 80°C (Dynamic Cure | Operating Temp: |
20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min) | Continuous: -55°C to 200°C |
Coefficient of Thermal Expansion (CTE): | Intermittent: -55°C to 300°C |
Below Tg: 31 x 10-6 in/in/°C | Storage Modulus @ 23°C: 808,700 psi |
Above Tg: 158 x 10-6 in/in/°C | Ions: Cl - 73 ppm |
Shore D Hardness: 75 | Na+ 2 ppm |
Lap Shear Strength @ 23°C: 1,475 psi | NH4+ 98 ppm |
Die Shear Strength @ 23°C: > 10 Kg / 3,400 psi | K+ 3 ppm |
Degradation Temp. (TGA): 425°C | *Particle Size: ≤ 45 Microns |
Electrical Properties: |
*Volume Resistivity @ 23°C: ≤ 0.0004 Ohm-cm |
Thermal Properties: |
| | Thermal Resistance: (Junction to Case) |
Thermal Conductivity: 2.5 W/mK Based on standard method: Laser Flash | TO-18 package with nickel-gold metallized 20 x 20 mil chips ａnd bonded with EPO-TEK? H20E (2 mils thick) |
Thermal Conductivity: 29 W/mK Based on Thermal Resistance Data: R = L x K-1 x A-1 | EPO-TEK? H20E: 6.7 to 7.0°C/W |
Solder: 4.0 to 5.0°C/W
|
滬公網安備31011502016460號
